型号:SP600-25 | 类别:热 - 垫,片 | 制造商:Bergquist |
封装:12-UFDFN 裸露焊盘 | 描述:THERMAL PAD DO-5 LARGE SP600 |
详细参数
类别 | 热 - 垫,片 |
---|---|
描述 | THERMAL PAD DO-5 LARGE SP600 |
系列 | Sil-Pad® 600 |
制造商 | Bergquist |
应用 | DO-5 |
形状 | 圆形 |
外形 | 25.40mm x 6.60mm |
厚度 | 0.009"(0.229mm) |
材料 | 硅质 |
粘合剂 | - |
底布qqq载体 | - |
颜色 | 绿 |
热阻率 | 0.35°C/W |
导热率 | 1.0 W/m-K |
供应商
深圳市科雨电子有限公司 | 汪小姐,15173547089,无线联通更快捷!171-4729-1886(微信同号) |
北京显周科技有限公司 | 刘先生13910052844(微信同步) |
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